IUnited States inogadzira semiconductor zvinhu zvine high thermal conductivity kudzvinyirira chip heat.
Nekuwedzera kwenhamba ye transistors mu chip, iyo komputa mashandiro ekombuta inoramba ichivandudza, asi iyo yakakwira densification inoburitsawo nzvimbo dzakawanda dzinopisa.
Pasina yakakodzera tekinoroji yekutarisira tekinoroji, kunze kwekudzikisa kukurumidza kwekushanda kwe processor uye kuderedza kuvimbika, kunewo zvikonzero zveKudzivirira kupisa uye kunoda kuwedzera simba, kugadzira matambudziko ekushaya simba.Kuti agadzirise dambudziko iri, iyo Yunivhesiti yeCalifornia, Los Angeles yakagadzira nyowani semiconductor zvinhu zvine yakanyanya kupisa yekupisa conductivity muna 2018, iyo inoumbwa isina chirema-isina boron arsenide uye boron phosphide, yakafanana nezviripo zvekupisa kupisa zvinhu senge. diamond uye silicon carbide.reshiyo, ine kanopfuura ka3 yekupisa conductivity.
Muna June 2021, Yunivhesiti yeCalifornia, Los Angeles, yakashandisa zvitsva semiconductor zvinhu kuti zvibatanidze nepamusoro-simba machipisi emakombuta kuti zvibudirire kudzvanya chizvarwa chekupisa chemachipisi, nekudaro kuvandudza kushanda kwekombuta.Chikwata chekutsvagisa chakaisa boron arsenide semiconductor pakati pechipi nechidzitiro chekupisa semusanganiswa wegiya rekupisa uye chip kuti chivandudze mhedzisiro yekupisa kupisa, uye kuita tsvakiridzo pamusoro pekushanda kwekupisa kwechigadzirwa chaicho.
Mushure mekubatanidza iyo boron arsenide substrate kune yakakura simba gap gallium nitride semiconductor, zvakasimbiswa kuti thermal conductivity ye gallium nitride/boron arsenide interface yaive yakakwira se250 MW/m2K, uye iyo interface yekupisa yekupisa yakasvika padanho diki zvakanyanya.Iyo boron arsenide substrate inosanganisirwazve neyepamberi yakakwirira erekitironi mobility transistor chip inoumbwa nealuminium gallium nitride/gallium nitride, uye zvinosimbiswa kuti kupisa kwekupisa kuri nani zvakanyanya kupfuura kwedhaimondi kana silicon carbide.
Chikwata chekutsvagisa chakashanda chip pachiyero chepamusoro, uye chakayera nzvimbo inopisa kubva mukamuri tembiricha kusvika kune yakanyanya tembiricha.Mhedzisiro yekuedza inoratidza kuti tembiricha yedhaimani inopisa sink i137 ° C, iyo silicon carbide heat sink i167 ° C, uye boron arsenide heat sink i87 ° C chete.Iyo yakanakisa thermal conductivity yeiyi interface inobva kune yakasarudzika phononic band chimiro che boron arsenide uye kubatanidzwa kweiyo interface.Iyo boron arsenide zvinhu haina kungoita yakakwira thermal conductivity, asiwo ine diki interface thermal resistance.
Inogona kushandiswa sechidzitiro chekupisa kuti uwane yakakwira mudziyo wekushandisa simba.Inotarisirwa kushandiswa mukure-kure-kure, yakakwirira-yakawanda isina waya yekutaurirana mune ramangwana.Inogona kushandiswa mumunda weakakwira frequency magetsi emagetsi kana emagetsi kurongedza.
Nguva yekutumira: Aug-08-2022